JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. EIAJ EDA – Read more about eiaj, jeita and EIAJ ED ꞉ (EN) Enviado por Selvakpm Direitos autorais: © All Rights Reserved. Baixe no formato PDF ou leia online no Scribd.

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A step stress of amount of deflections with 1. Table 3 shows the judgment method proposed. The criterion of judgement is in principle to conform with separate specification. F Maximum allowable supply voltage? Mounting conditions, printed wiring boards, soldering materials, and so on affect significantly the kk Note 1. These temperatures adopted by car manufacturers were additionally noted as one of the test conditions.

Example, too many times and a few mistaking between the newest version and old version. In particular, utmost attention should be paid to the precautions indicated in the detail specifications.

Printed circuit board This specification shows the conditions of general printed circuit board. Definition of Terms …………………………………………………………………………………………… 3. The temperature on the surface of the specimen at the point specified in the relevant specifications. Toshiki Yamaguchi Fujitsu Ltd. This status never occurs in actual use.

IEC Ed 2.

In ev-4702 case of dual lead package such SOP and so on, the push load shall be applied to middle of no lead side of the package, in Figure 2. Such being the eiam, we would highly appreciate your cooperation in presenting to us the following data to be submitted to us: This phenomenon might affect to broken strength data. The temperature of package shall be checked by measuring method described in Figure 1 and Figure 2.


And to check out limit deflection, it is discussed that to measure electrical characteristics while changing amount of deflections. Under the temperature cycling test conditions shown in Table 1, a majority said that there was correlation with the assumed conditions in the market; therefore, the acceleration equation was employed.

Unless otherwise specified, perform this test only once. The soldering strength in this case depends very much on the mount methods, the mount conditions, the used materials, the printed wiring boards, and so on. Therefore, the test specified in this standard shall not kk Note 1. Land sizes define top diameter. B T H B Temperature: Strength tests for soldering joint Method 1: Bond sample SMD with adhesive to a printed circuit board.

From the circumstance above, wedecided to establish the drop test standard. R hardened steel or hard metal Remarks 1 Adequately select a number of cycles as usage 2 When a printed circuit board mounted a too large SMD is bent, the surface of the printed circuit board presses the backside of the SMD. This test method is neither applicable nor necessary if there is no doubt of the result of the test for mount reliability evaluation. The life tests and the strength tests was subdivided according to the revision frequency.


Steady State Relative Humidity: It is recommended electrical characteristics should be checked holing the specified deflection. The radius of curvature of PCB can be shown as follows: The specimen shall be dropped with suspended by thread.

JEITA / JEITA Standards / Electronic Devices Standardization / Semiconductor Devices Reliability

As the other method for lead less parts, there eizj the test method applies load from back side through the hole of test board. Makoto Kanayama Shindengen Electric Mfg. Test Equipment The equipment and tools used in this test shall conform to section 3. E Except above pitches, separately specified. Take care so that the surface temperature of the sample SMD does not exceed the specified temperature during mounting.

3-3 Standards Related to Reliability Test |Sanken Electric

Taking into consideration such changes of the eizj, it is decided to newly establish the environmental and endurance test methods for the semiconductor devices being mounted on the board.

Figure 1 shows an example of method 1. Number of test cycles: P Tstgmin 22 IEC ? Reiterative bending test for surface mount Device Test Method