Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.

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From Wikipedia, the free encyclopedia. Porosity Sealing or Resin Impregnation is similar to potting, but doesn’t use a shell or a mold.

Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Packaegs technology Through-hole technology. Parts are submerged in a polymerizable monomer or packagws low viscosity plastic solution.

The design of these products depends on the production method and require careful consideration of dimensions and tolerances and tooling design. Gasketed metal castings are sometimes used to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water.

Electronic packaging

Packaging of an electronic system must consider protection from mechanical damage, hermiticitt, radio frequency noise emission and electrostatic discharge. Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate.

Curing can consist of polymerizing the internal resin or evaporating the solvent, which leaves an insulating dielectric material between different voltage components. Pl can be post-processed to provide conductive surfaces. High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, extreme temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible lightsalt electeonic, explosive shock, and many more.


It prevents ionization from forming between closely spaced live surfaces and initiating failure. Potting can be rigid or soft. Such knowledge is important to prevent immediate or premature electronic product failures.

In the design of electronic products, electronic packaging engineers perform analyses to germiticity such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments. This type of packaging can also be divided into two main types: December Learn how and when to remove this template message.

Six Sigma: Hermeticity Testing

Hsrmiticity and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly.

Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid elwctronic.

Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Articles needing additional references from December All articles needing additional references.

The pressure above the fluid is lowered to a full vacuum. The tool of choice is a numerically controlled vertical milling machine, with automatic translation of computer-aided design CAD files to toolpath command files. Vacuum potting works best with resins that cure by polymerization, rather than solvent evaporation.

It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made for prototypes and small production runs with little custom tooling expense. Formally called “encapsulation”, potting consists of immersing the part or assembly in a liquid resin, then curing it.

Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Piece part costs are high, but there is little or no cost for custom tooling, and first-piece deliveries can elwctronic as little as half a day. It can be very economical, but somewhat difficult to achieve consistent process quality.

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Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures. This industry developed the glass-seal electrical feedthrough, using alloys such as Kovar to match the coefficient of expansion of the sealing glass so as bermiticity minimize mechanical stress on the critical metal-glass bond as the tube warmed up.

It’s widely used on mass-produced items such as axial-lead resistors, and sometimes on printed circuit boards. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal.

Electronic packaging – Wikipedia

Potting can be done in a pre-molded potting shell, or directly in a mold. Examples are injection molding, transfer molding, vacuum forming, and die cutting. By using this site, you agree to the Terms of Use and Privacy Policy.

This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage. Some later tubes used metal cases and feedthroughs, and only the insulation around the individual feedthroughs used glass. Please help improve this slectronic by adding citations to reliable sources. Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure. Quantities tend to be small; eectronic only one unit of a ;ackages design is required.

See Conformal coatingParylene. Aluminum die castings are more common than iron or steel sand castings.